Helpful Research on Embedded Die Packaging Technology Industry

Electronic packaging is the design and manufacture of housings for electronic devices, ranging from individual semiconductor components to complete systems such as mainframes. When packaging an electronic system, protection from mechanical damage, cooling, high-frequency noise emissions and electrostatic discharge must be taken into account. Product safety standards can prescribe certain characteristics of a consumer product, e.g. B. the outside temperature of the housing or the grounding of exposed metal parts.

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Some of the key players of Embedded Die Packaging Technology Industry:

AT & S, Toshiba Corporation, General Electric, Taiwan Semiconductor Manufacturing Company, TDK-Epcos, Amkor Technology, Microchip Technology, Schweizer, Infineon, Fujikura, Fujitsu Limited, STMICROELECTRONICS

Prototypes and industrial plants that are manufactured in small quantities can use standardized off-the-shelf housings such as card cages or prefabricated cardboard boxes. Mass market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is an important discipline in the field of mechanical engineering.

Electronic packaging is based on mechanical engineering principles such as dynamics, stress analysis, heat transfer and fluid mechanics. Highly reliable devices often have to withstand drop tests, loose cargo vibrations, secured cargo vibrations, extreme temperatures, humidity, immersion or spraying of water, rain, sunlight (UV, IR and visible light), salt spray, explosion shock and much more. These requirements go beyond and interact with electrical design.